ATA Engineering Recognized by Merrick-RS&H Joint Venture for Engine Test Cell Project Support

SAN DIEGO, Calif., December 1, 2025 – ATA Engineering, Inc., (ATA) was honored to receive four commemorative challenge coins from our valued customer Merrick-RS&H Joint Venture, acknowledging ATA’s expertise and role in the collaborative redesign of an engine test cell to accommodate a higher-thrust engine.

ATA’s role in the program centered on applying our vibroacoustic expertise to evaluate and improve the acoustic environment within the test facility. The ATA Engineering team, composed of Dr. Parthiv Shah, Dr. Michael Yang, and Mr. Derek Berg, worked to analytically predict noise levels at specific locations throughout the facility under a range of noise control treatments. The approach utilized a novel aerovibroacoustic modeling method to characterize the interior acoustic environment of the engine test cell. The method integrated high-fidelity unsteady computational fluid dynamics (CFD) simulations, distributed equivalent acoustic source models, boundary element methods (BEM) for low-frequency predictions, and statistical energy analysis (SEA) for high-frequency predictions.

The team’s findings were detailed in the technical paper “Methods for High-Speed Jet Exhaust Aero-Vibro-Acoustic Modeling in Engine Test Cells,” which was published at the 2025 ASME Turbomachinery Technical Conference and Exposition (Turbo Expo) hosted by the American Society of Mechanical Engineers.  A presentation was also given at the 2025 Spacecraft and Launch Vehicle (SCLV) Dynamic Environments Workshop, hosted by The Aerospace Corporation.

ATA Engineering extends our sincere appreciation to Merrick-RS&H Joint Venture for their trust and collaboration throughout this significant effort. The partnership highlights a shared commitment to innovative engineering solutions, and both organizations look forward to continued successful collaboration on future projects.

To learn more about ATA’s contributions to this program, request the full technical publication here.

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