This webinar introduces computational fluid dynamics (CFD) analysis to detect and solve thermal issues in electronic systems. If you have experienced the costs of product thermal failures or significant late-stage design reworks based on prototype thermal testing, you know the value of learning and applying good design practices for thermal management of electronics products earlier in the design cycle. CFD analysis for electronics cooling gives engineers the means to predict airflow and temperature of electronic components earlier in the development process to ensure reliable performance in the field.

To that end, Siemens Simcenter FLOEFD—a CAD-embedded general-purpose 3D CFD software tool—provides the ability to predict airflow and heat transfer in and around electronic equipment, including the coupled effects of conduction, convection, and radiation. FLOEFD is available embedded within Simcenter 3D and can now be accessed using Simcenter 3D value-based licensing tokens. Attend this webinar to learn more!

What you will learn:

• How the FLOEFD module works with the Simcenter 3D environment
• How to set up a thermal model and apply all the parameters needed for analysis
• How to model thermal components such as heatsinks, fans, heat pipes, and thermal interface materials.
• How to handle important analysis aspects such as mesh control and solver monitoring
• How to interpret results visually and numerically
• How design changes can be quantified and used to thermally optimize the design

This webinar is relevant for:

• NX users
• Design engineers
• Thermal analysts
• Structural analysts
• CAD managers/administrators